ʻO Samsung Automatic SMT koho a waiho i ka mīkini SM471
01
hana
Ala kaʻahele pālua ʻelua
Hoʻonui nui ke ʻano hana ʻelua i ka hiki o nā papa liʻiliʻi a hōʻoia i ka scalability no nā papa nui me kahi ala huakaʻi.
02
Paʻa pono
Ka nānā ʻana i nā ʻāpana ma mua a ma hope o ke kau ʻana
ʻO ka nānā ʻana i ka nozzle contamination i ka wā o ke kaʻina hana hiki ke pale i ka nui o nā ʻāpana mai ka nalo ʻana a me nā ʻāpana i hoʻolei ʻia ma mua.
Nā kikoʻī:
| Hoʻohālike | SM471 | ||
| Hoʻopololei | ʻIke lele | ||
| Ka helu o na milo | 10 Spindles x 2 Gantry | ||
| Ka wikiwiki hoʻokomo | 75,000 CPH(ʻOi loa) | ||
| Hoʻokomo pololei | Chip | ± 50um@p+3a (Ma muli o nā ʻāpana maʻamau) | |
| Huihui | Chip 0402 ~ E4mm(H 12mm) IC, Mea Hoʻohui (Lead Pitch 0.4mm) BGA, CSP(Pōʻani Poʻe 0.4mm) | ||
| Ana Papa (mm) | liʻiliʻi | 50(L) x 40(W) | |
| Ka nui | Alanui Hookahi | 510(L)x 460(W) 610(L)x460(W)(Koho) | |
| Alanui Kaulua | 460(L) x 250(W) 610(L)x250(W)(Koho) | ||
| Mānoanoa PCB | 0.38 〜4.2 | ||
| Mea hanai Ca | pacity (Ma muli o 8mm) | 120ea /112ea(Kaʻa Paʻa) | |
| Mea hoohana | Ka mana | AC200/208/220/240/380/415\/^QWHz,3Phase) Max.5.O<\A | |
| Hoohana Ea | 0.5 ~ 0.7MPa(5 ~ 7kgf/cnr) 350NQ /min 502/min | ||
| Mass | Ma kahi o.1,820 kg | ||
| Ana waho (mm) | 1,650(L)x 1.690(D) x 1.485(H) | ||
