ʻAʻole i kau ʻia ka nui o nā mea uila me ka hoʻohana ʻana iā SMD.No kēia kumu, pono e hoʻokomo ʻo SMT i kekahi mau mea i loko o ka puka.ʻO nā ʻāpana mauna o ka ʻili, ka hana a me ka passive, ke hoʻopili ʻia i kahi substrate, e hana i ʻekolu ʻano nui o nā hui SMT - i kapa ʻia ʻo Type I, Type II a me Type III.Hoʻopiliʻia nāʻano likeʻole ma kahiʻano likeʻole, aʻo nāʻanoʻekolu a pau e pono ai nā mea hana likeʻole.
1. Aia i loko o nā hui SMT Type III wale nō nā ʻāpana mauna ʻili (nā pale, nā capacitors a me nā transistors) i hoʻopili ʻia ma ka ʻaoʻao lalo.
2.Type I nā mea i loaʻa i luna mauna mea wale nō.Hiki i nā ʻāpana ke hoʻokahi ʻaoʻao a ʻelua ʻaoʻao.
3. ʻO nā ʻāpana ʻano II ka hui pū ʻana o Type III a me Type I. ʻAʻole maʻamau i loaʻa i nā mea mauna ʻili ʻeleʻele ma ka ʻaoʻao lalo, akā hiki ke loaʻa nā ʻaoʻao mauna ʻili ma ka ʻaoʻao lalo.
Inā nui a maikaʻi ka pitch, e piʻi aʻe ka paʻakikī o ka hui SMT i nā lako uila.
Hoʻohana ʻia ka pitch ultra-fine, QFP (Quad Flat Pack), TCP (Tape Carrier Package) a i ʻole BGA (Ball Grid Array) a me nā ʻāpana chip liʻiliʻi loa (0603 a i ʻole 0402 a i ʻole ka liʻiliʻi) no kēia mau ʻāpana a me nā kuʻuna (50 mil pitch. )) pūʻolo mauna ʻili.
ʻO nā kaʻina hana no nā mauna ili āpau ʻekolu - nā adhesives, solder paste, hoʻokomo, kūʻai ʻana a me ka hoʻomaʻemaʻe a ukali ʻia e ka nānā ʻana, hoʻāʻo a hoʻoponopono.
ʻO Chengyuan Industrial Automation, kahi mea hana SMT loea.
Ka manawa hoʻouna: Mar-29-2023